http://www.optosupply.com ver a.0 t t o o p p s s 1 1 0 0 0 0 p p o o w w e e r r p p u u r r e e w w h h i i t t e e l l e e d d o o s s w w 4 4 x x a a h h d d e e 1 1 e e ver . 1 features outline dimension high-power led long lifetime operation typical viewing angle : 140deg rohs compliant possible to attach to heat sink directly without using print circuit board. applications indoor & outdoor lighting stage lighting reading lamps display cases, furniture illumination, marker architectural illumination spotlights 6 o j u n n 5 p m f s b o d f ? n n 5 p m f s b o d f t b s f g p s s f g f s f o d f p o m z absolute maximum rating 5 b
directivity item symbol value unit dc forward current *1 i f 3,500 ma pulse forward current*2 i fp 4,000 ma reverse voltage v r 50 v power dissipation*1 p d 157,500 mw operating temperature topr -30 ~ +85
storage temperature tstg -40~ +100
lead soldering temperature tsol 260
/5sec *1, power dissipation and forward current are the value when the module temperature is set lower than the rating by using an adequate heat sink. *2, pulse width max.10ms duty ratio max 1/10 electrical -optical charac teristics 5 b
item symbol condition min. typ. max. 6 o j u dc forward voltage v f i f =3000ma 35 38 45 v dc reverse current i r v r =50v - - 100 a luminous flux v i f =3000ma 5500 7200 - lm color temperature cct i f =3000ma - 6500 - k x i f =3000ma - 0.31 - chromaticity coordinates* y i f =3000ma - 0.34 - 50% power angle 2 1/2 i f =3000ma - 140 - deg note: don?t drive at rated current more than 5s without heat sink for high power series . * tolerance of chromaticity coordinates is + 10% , * tolerance of luminous flux is + 20% led & application technologies
http://www.optosupply.com ver a.0 t t o o p p s s 1 1 0 0 0 0 p p o o w w e e r r p p u u r r e e w w h h i i t t e e l l e e d d o o s s w w 4 4 x x a a h h d d e e 1 1 e e ver . 1 heat design the following pictures show some measurem ents of mounted 5w led on the heat sink for each board a and b (see fig 1) with using thermograph to make an observation about heat distri bution. each boards is tested at various current conditions. as a result, led needs larger heat sink as much as possible to reduce its own case temperature. fig. 1 configuration pattern examples for board assembly board led power material surface area (m ) min. a 5w al 10,300 b 10w al 20,600 c 25w al 51,500 d 50w al 103,000 e 100w al 206,000 f 200w al 412,000 g 300w al 618,000 above tested led device is attached w ith adhesive sheet to the heatsink. for reference's sake, tj absolute maximum rating is defined at 115 ? as a prerequisite on design process of 5w led. board a (surface area=10,300m ) board b (surface area=20,600m ) if=600ma if=600ma led & application technologies
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